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The whole process of PCBA circuit board assembly includes PCB processing, component procurement and inspection, SMT placement and DIP plug-in post-soldering and other processes. The entire PCBA circuit board processing process involves a wide range of areas and includes many quality control details. If there is no very strict quality control standard, the PCBA circuit board quality will be abnormal. If the inspection standard is not strict or there is no standard to follow, it is very likely that a small link will make a mistake and cause the entire batch of PCBA circuit boards to be scrapped or need to be repaired. Resulting in serious quality accidents. So, how to do a good job in quality control of PCBA circuit board processing?

1. PCB circuit board processing

After receiving the order of the PCBA circuit board, analyze the Gerber file, pay attention to the relationship between the hole spacing of the PcB and the bearing capacity of the board, do not cause bending or breakage, and whether the wiring takes into account key factors such as high-frequency signal interference and impedance.

2. Procurement and inspection of components

In order to ensure the quality stability and quality of components, it is necessary to strictly control the purchase channels of suppliers and the qualifications of suppliers. It is generally designated to get the goods from large traders and original manufacturers, so as to avoid the use of second-hand materials and counterfeit materials. In addition, it is necessary to set up a special PCBA incoming material inspection post to strictly inspect the following items to ensure that the components

are free of faults. PCB: Check the reflow oven temperature test, whether the vias without flying leads are blocked or leaking ink, whether the board surface is bent, etc. IC: Check if the screen printing is exactly the same as the BOM, and keep it at constant temperature and humidity. Other commonly used materials: check screen printing, appearance, power measurement value, etc.

3. SMT chip processing

The temperature control of solder paste printing and reflow soldering oven is the key point, and it is very important to use a laser stencil with good quality and meeting the process requirements.

According to the requirements of the PCB, some of them need to increase or reduce the size of the stencil hole, or use U-shaped holes to make the stencil according to the process requirements. The furnace temperature and speed control of reflow soldering is critical to the infiltration of solder paste and soldering reliability, and it is sufficient to control according to the normal SOP operation guidelines. In addition, AOI detection needs to be strictly implemented to minimize the adverse effects caused by human factors.

4. DIP plug-in processing

In the process of plug-in processing, the design details of the mold for wave soldering are the key. How to use the mold carrier to greatly improve the yield rate is a process experience that PE engineers must constantly practice and summarize.

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