PCB Assembly Capability |
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Item |
Lot Size |
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Normal |
Special |
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PCB(used for SMT)spec |
(L*W) |
Min |
L≥3mm |
L<2mm |
W≥3mm |
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Max |
L≤800mm |
L > 1200mm |
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W≤460mm |
W> 500mm |
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(T) |
Min thickness |
0.2mm |
T<0.1mm |
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Max thickness |
4mm |
T>4.5mm |
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SMT components spec |
Outline Dimension |
Min size |
0201 |
01005 |
(0.6mm*0.3mm) |
(0.3mm*0.2mm) |
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Max size |
60mm*48mm |
200mm*125mm<SMD |
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component thickness |
T≤15mm |
6.5mm<T≤15mm |
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QFP、SOP、SOJ(multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch<0.4mm |
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CSP,BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch<0.5mm |
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DIP PCB SPEC |
(L*W) |
Min Size |
L≥50mm |
L<50mm |
W≥30mm |
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Max Size |
L≤1200mm |
L≥1200mm |
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W≤450mm |
W≥500mm |
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(T) |
Minimum Thickness |
0.8mm |
T<0.8mm |
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Maximum Thickness |
3.5mm |
T>2mm |
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BOX BULID |
FIRMWARE |
Provide programming firmware files,Firmware + software installation instructions |
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Function Test |
Level of testing required along with test instructions |
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Plastic & Metal Casings |
Metal Casting,Sheet Metal work,Metal Fabrication,Metal Fabrication,Metal and plastic extrusion |
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BOX BUILD |
3D CAD model of enclosure + specifications (include drawings, size, weight, colour, material, finish, IP rating, etc) |
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PCBA FILES |
PCB FILE |
PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) |