SMT (Surface Mount Technology) patch processing is one of the important processing methods in the modern electronics manufacturing industry. However, when performing SMT processing , various failures are often encountered. If these failures are not discovered and resolved in time, it will cause great trouble and loss to production. Therefore, this article will introduce the common faults and solutions of SMT patch processing .

Fault 1: Components failed to complete correct position correction

First of all, when processing the patch, the processor makes a steel mesh according to the GERBER file. For components with small size or high precision requirements, the position correction is usually completed by using data alignment. However, data alignment cannot be done if the standard position of the component is incorrect or if the component outline is lost due to the sample size. Therefore, we should complete this task through position adjustment in SMT patch processing. To solve this problem, we need to use a high-precision and high-resolution open-loop translation machine to complete position matching during the patch production process.

Another common problem is that some patches cannot be processed correctly in the designated position due to equipment wear or operator error. This problem is very common in patch processing. In this case, the position of the table can be calibrated manually, but the accuracy is limited. A more ideal solution is to use an automated calibration method. In these methods, trigger switching can be used to control the position of patch processing through triggers.

Fault 3: The elastic force of the upper and lower structures of the components cannot be adjusted evenly
Usually, SMT manufacturers often have the problem of uneven elasticity of the upper and lower structures. This problem can be solved by balancing. When making the stencil, you can increase the support of the circuit board in the corresponding area, so that the mutual influence between adjacent components can be avoided as much as possible. At the same time, when pasting components, you can use holographic positioning to make them complete their functions in a balanced position.

Fault 4: Polarity or direction of components
Another common situation is incorrect orientation or polarity of components. Sometimes, the logo of the component itself will appear during the SMT chip processing process, which is inconsistent with the logo in the steel mesh. Usually the reason for this situation is that the deviation of the bottom plate is too large. In order to solve this problem, we can adopt the method of visual matching, and increase the control of incremental sensor at the same time.

Fault 5: Elements are leveled
Sometimes we need to level the machined elements when the real stress of the material is not good. Leveling can be achieved in a variety of ways, such as adding object support or changing the contour of the machining. In addition, it is also possible to use software to adjust the workbench, but it should be noted that this method will lose a certain amount of processing quality.

Summary: SMT patch factory is one of the most commonly used methods in electronic processing, which also means that various problems are inevitable. However, as long as these faults are deeply analyzed and corresponding solutions are found, then we can guarantee the quality and stability of the entire production line.

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