The main factors affecting the thermal conductivity of aluminium-based circuit boards
2023/04/07
The thermal conductivity of aluminium-based circuit boards can be affected by several factors, including:
Composition:The composition of the aluminium-based circuit board can greatly impact its thermal conductivity. For example, the presence of impurities or alloying elements can reduce the thermal conductivity.
Thickness: The thickness of the aluminium layer in the circuit board can also have an impact on thermal conductivity. Thicker layers typically have higher thermal conductivity than thinner ones.
Surface finish: The surface finish of the aluminium layer can affect the thermal conductivity by altering the surface roughness and increasing or decreasing contact area with other materials.
Bonding technique: The method used to bond the aluminium layer to the substrate can also influence thermal conductivity. For example, thermal interface materials (TIMs) can be used to improve heat transfer across the interface between the aluminium layer and the substrate.
Temperature: The temperature of the aluminium-based circuit board can also affect thermal conductivity. Higher temperatures typically lead to lower thermal conductivity due to increased thermal resistance and thermal expansion.
Orientation and shape: The orientation and shape of the aluminium layer can also have an impact on thermal conductivity. For example, a circular or rectangular shape with uniform thickness typically has higher thermal conductivity than an irregular shape with varying thickness.
Overall, optimizing the composition, thickness, surface finish, bonding technique, and shape of the aluminium layer can help improve the thermal conductivity of aluminium-based circuit boards.
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