Nowadays, the market of electronic products is broader, and the competition is more fierce, and FPC flex board as an important part of it, its process is more attention. Ucreate pcb founded in 2001, focusing on flexbile printed circuit board and rigid board with more than 19 years.
We can produce 1-12 layers FPC, the board material FR-4, High TG, PI,High speed always used for making Flex circuit board.
If any specail requirement, pls send email to sales@ucreatepcb.com, thanks.
The following will discuss how to use FPC flexible technology to create FPC electronic products.
What is FPC circuit board?
The FPC board ( flexible printed circuit board) is mainly composed of substrate, conductive layer, cover layer, surface treatment, etc. It has extremely high flexibility and plasticity, and has excellent conductive performance and signal transmission ability, and is often used in the components connecting multiple circuit boards or chips in electronic products.
The Process flow of FPC
The production of FPC circuit board needs to involve multiple technological processes, including substrate cutting, conductive layer production, cover layer production, surface treatment, marking, edge cutting debugging, etc. And requires strict control of process parameters and environment.
1. Substrates cutting
Substrate cutting is the first step and the foundation of the whole FPC flexible board process. The substrate usually uses polyester or polyimide and other high temperature materials, cutting requires high cutting precision, neat edges, no burr.
2. Conductive layer production
The conductive layer is the most core layer in the FPCs, which needs to make the conductive pattern first, and then deposit the metal film on the substrate. The fabrication process of the conductive layer requires strict control of process parameters and environment, such as lithography, etching, passivation, etc.
3. Coverage production
The main role of the overburden layer is to protect the conductive layer, and it also has the characteristics of anti-pollution resistance and corrosion resistance. The focus of the production is the selection of materials and the control of the production process, which requires high smoothness of the cover surface, uniform thickness and no pores.
4. Surface Finish
The surface finish is mainly designed to improve the gloss, oxidation resistance, electrostatic reduction and corrosion resistance of the surface of flex circuit board. The surface finish includes Plated Ni/Au, ENIG, Immersion Tin,Immersion Ag, OSP etc. Among which immersion gold is the most widely used surface finish method at present.
Advantages of the FPC
1. Flexible design
The main advantage of FPC board is its extremely high flexibility and plasticity, which can meet the special application requirements and design requirements of various printed circuits. Especially for circuit board designs that need to fold or bend, using FPC board is the best choice.
2. Improve the connection reliability
The design of FPC board connector is more compact and refined. Compared with ordinary rigid circuit board, it has higher reliability and can meet the needs of mass production, which can greatly improve the performance and service life of electronic products.
3. Improve production efficiency
The FPC board adopts the lead-free manufacturing process, which does not need to be used in the production process, and meets the requirements for environmental protection. At the same time, because the flex printed circuit board has curved processing mode, it is more convenient in assembly, which can greatly improve the production efficiency, and is also a very cost-effective processing method.
4. Application of FPC in electronic products
The application scope of FPC board is very wide, covering electronic products manufacturing, communication technology, auto parts, medical equipment and other fields. In the technology products more and more deeply into life today, FPC is undoubtedly an indispensable part of the modern electronics industry. The application of FPC circuit board process can help manufacture high performance and reliable electronic products.
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