ENIG (Electroless Nickel Immersion Gold) is a surface finish used in the production of printed circuit boards (PCBs). It involves depositing a thin layer of nickel onto the copper pads and traces of the PCB, followed by a layer of immersion gold. (4 Layer ENIG PCB Board) The main advantage of ENIG is its flat surface, which makes it suitable for fine-pitch surface mount technology (SMT) components...

ENIG (Electroless Nickel Immersion Gold) is a process used for circuit board surface finishing, generally referred to as ‘electroless nickel immersion gold’, also referred to as ‘electroless nickel immersion gold’ or ‘gold immersion gold’, is widely used in mobile phone circuit boards, and some BGA package IC carrier boards will also use ENIGE or NEPIG (electroless nickel palladium gold). ENIGE or...