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The multilayer PCB or multilayer printed circuit board in the smt patch is a circuit board composed of two or more conductive layers (copper layers). The copper layers are pressed together by layers of resin (prepreg). Due to the complex manufacturing process of multi-layer PCB, low output and difficult rework, the price of smt patch factory is relatively higher than that of single-layer and double-sided PCB.

The multi-layer printed circuit in the smt chip processing plant is the product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and ultra-large-scale integrated circuits, multilayer printed circuits are developing rapidly in the following directions: high density, high precision and high layers, tiny lines and small holes, blind buried Holes, high thickness-to-aperture ratio and other technologies meet market demand.

It can be manufactured in smt processing factory . The four-layer board generally adopts a core board with one layer of copper foil on one side and a three-layer board with one layer of copper foil on one side. They must be pressed together.

The difference in process cost between the two is that the four-layer board has an extra layer of copper foil and bonding layer. There is little difference in cost. When the smt chip processing factory quotes, it is generally an even-numbered quote. Also, 3-4 layers are usually quoted as a class. (For example: if you design a 5-layer board, the other party will quote the price of a 6-layer board. That is to say, the price you design for a 3-layer board is the same as the price for a 4-layer board.)

In terms of PCB technology, the four-layer PCB board is better controlled than the three-layer board, mainly in terms of symmetry. The warpage of the four-layer board can be controlled below 0.7% (IPC600 standard), but the size of the three-layer board is relatively large. At that time, the warpage will exceed this standard, which will affect the reliability of SMT assembly and the whole product. Therefore, designers should not design odd-numbered laminates. Even if an odd numbered layer is necessary, it will be designed as a false even numbered layer. That is, design 5 layers into 6 layers, and design 7 layers into 8 layers.

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