Solutions To Poor Soldering In SMT
2024/06/13
At present, AOI is the most mainstream and efficient detection method in the SMD foundry industry. Every product of Enercon Electronics will pass AOI. AOI can detect many kinds of defects, including poor solder paste, poor component placement, poor reflow soldering, etc. Some of them can be repaired. The following introduces the most frequent welding defects and solutions we encounter in the production process:
1. Cold welding
The surface of the solder joint is like tofu dregs. Mainly due to the insufficient temperature of the soldering iron, or the shaking of the weldment before the solder solidifies, the strength of the poor solder joint is not high, the conductivity is weak, and it is very easy to cause the failure of the component to break when subjected to external force. The solution is to reheat the joint and remove the excess solder.
2. Short circuit
This happens when the solder crosses and physically connects the two leads together. These may form unexpected connections and short circuits, which may cause the component to burn out or burn out the traces when the current is too high. At this time, the components need to be removed and re-soldered.
3. Component damage, reverse pasting
Sometimes due to operational errors, components will be bumped and damaged. Or due to negligence in work, the patch is missed or reversed. The solution to this situation where refilling is needed is very simple, just refill the patch immediately. But it is a test for the company's supply chain. If there is no available material on hand, the delivery date will be delayed.
4. Uneven pins of plug-in and loose components
Uneven pins generally do not affect the function. Loose components are not easy to find and require very detailed inspection. For such defects, Ainengkang Electronics will conduct detailed appearance inspections, high standards and strict requirements, early detection and early treatment.
5. Tin beads and tin slag
The preheating temperature is low (the flux solvent is not completely volatilized); the board speed is fast and the preheating effect is not achieved; the chain inclination is not good, there are bubbles between the tin liquid and the PCB, and tin beads are generated after the bubbles burst; improper operation when hand-dipping tin; humid working environment, etc. will generate tin beads. The solution is ultrasonic cleaning, and blow it clean with an air gun after cleaning.
6. Surface dirt
Such as solder resist residue, foreign matter, fingerprints, etc., need to be cleaned with special board washing water.
Ucreate PCBA factory has been focusing on electronic product design, development, component mounting and burning test for more than 19 years. We provides SMT patches, THT plug-ins, and one-stop assembly and processing of finished products for various electronic products, providing the best quality products and services for your electronic product needs.
Related Posts:
1. What is SMT assembly?
2. Why is PCB solder mask necessary?
3.What Is Box Build Assembly?
4.The quality control of PCBA processing
5.The Benefits of AOI
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