In the ever-evolving world of electronics, High-Density Interconnect (HDI) PCBs have become the backbone of compact, high-performance devices. As a leader in advanced PCB manufacturing, Ucreate leverages cutting-edge technology to deliver 1+n+1, 2+n+2, and 3+n+3 HDI solutions tailored for industries ranging from consumer electronics to automotive and aerospace. Let’s break down the technical nuances and showcase how our expertise ensures unmatched quality.

1+N+1 Structure HDI

Definition: The simplest HDI type, featuring a single build-up layer on each side of the core (e.g., 1+4+1 for a 6-layer board). Laser-drilled microvias connect adjacent layers (e.g., L1-L2 and L5-L6).
Applications: Ideal for smartphones, wearables, and IoT devices where space and weight are critical.
Ucreate’s Edge: Our automated laser drilling ensures precision (≤100µm holes) with a 99.9% first-pass yield, supported by 3D-SPI and AOI inspection systems.

2+N+2 Structure HDI

Definition: Adds two build-up layers per side, requiring two laser drilling steps and sequential lamination. Microvias may be staggered (non-overlapping) or stacked (aligned).
Applications: High-end TVs, servers, and medical devices demanding higher signal integrity.
Ucreate’s Innovation: Proprietary Any-layer Interconnect (ALIC) technology minimizes signal loss (<0.5dB at 10GHz), while our mSAP (modified Semi-Additive Process) achieves 30µm line/space for ultra-fine circuits.

3+N+3 Structure HDI

Definition: The most complex, with three build-up layers per side and three lamination cycles. Enables connections across non-adjacent layers (e.g., L1-L4) via stacked or staggered microvias.
Applications: Automotive ADAS, AI servers, and aerospace systems requiring extreme reliability.
Ucreate’s Mastery: Our 15µm dielectric layers and low-loss materials (M7/M8) ensure thermal stability (Tg ≥180°C) for harsh environments. Advanced X-ray inspection guarantees 100% via integrity.

Besides, we can produce 4+N+4 HDI as well as any layer connection.

Why Choose Ucreate for HDI Solutions?
End-to-End Capabilities: From design optimization using AI-powered DFM tools to full-turnkey PCBA services, we streamline production with 48-hour rapid prototyping and ISO-9001-certified quality control.
Scalable Infrastructure: With 12,000㎡ facilities (including automatic SMT lines and Yamaha YSM20R-2), we support high-mix, high-volume orders.
Industry 4.0 Integration: IoT-enabled MES systems and real-time analytics reduce lead times by 30% while cutting waste.

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