Module PCBs are basically designed with half holes, mainly for the convenience of welding, small module area, and many functional requirements. The usual half hole is to design a hole on the edge of the PCB, and cut half of the shape, leaving only half of the hole on the PCB, commonly known as a half hole circuit board. Metallized half-hole PCBs are less used in various industries than PCBs. Metallized half-holes are easy to pull out the sinking copper in the hole during edge milling,so the scrap rate is very high.

Precautions for metallized semi-hole circuit board processing ? In the production process of half-hole circuit boards, the gong board technology is the key, and the copper wires and copper skins often appear in the gong board process, which has caused great difficulties in the production of half-hole boards. At the same time, there will be two gong boards in the production process of the half-hole circuit board, which are thick gongs and thin gongs. The two gong boards are to protect the copper wires in the half-hole board and ensure its quality, but the manufacturing process is relatively complicated. It has greatly affected the production efficiency of the half-hole circuit board.In order to control the production of metal half-hole plates, due to process problems, some measures are usually taken to intersect the copper skin of the metallized half-hole and the non-metallized hole.

For the inversion of the front, it is necessary to prevent the product from being corrected in the subsequent process due to the quality. The production process of this type of board is processed according to the following process:

Drilling (drilling, gong groove)-board surface electroplating-external light imaging -Graphic electroplating-drying-half hole treatment-flm removal, etching, tin stripping-other processes-shape. The specific metallized half-hole circuit board is processed in the following way. All the metallized half-hole PCB holes are drilled in the pattern after plating, and one hole is drilled at the intersection of the two ends of the half-hole before etching; the metal half-hole is one drill When drilling (or gong out), the second half-drill hole after plating and before etching, it is necessary to consider whether copper will be exposed when the shape of the gong is drilled, and move the half-drill hole into the unit; the right hole (drill half-hole) first After drilling, turn the board over (or mirror) and drill the left hole. The purpose is to reduce the pulling of the copper in the half hole by the drill tool, resulting in the lack of copper in the hole. The size of the drill bit for half-hole drilling depends on the distance between the outline lines. Draw the solder resist film, and increase the window opening to 4mil for the gap.