With the rapid development of science and technology, more and more equipment is designed for microwave frequency band (> 1GHz) or even millimeter wave field (30 ghz) applications, which also means that the frequency is getting higher and higher for the circuit board substrate, for example, the substrate material needs to have excellent electrical performance and good chemical stability. With the increase of power signal frequency, the loss on the substrate is very small, so the importance of high frequency board pcb is prominent. Ucreate PCB Engineer to introduce the classification of PCB high frequency boards!

1. Final ceramic is filled with thermosetting material

Similar to the PCB factory processing process of cycloargon resin / glass woven cloth (FR 4), the plate is brittle and easy to break the plate, and the drilling and gong plate and gong knife life should be reduced by 20%.

2. PTFE  material

1）Opening: the protective film must be retained to prevent scratches and indentation

2) Drilling:

• With a new nozzle (standard 130), one stack is optimal with a foot pressure of 40 psi
• The aluminum plate is the cover plate, and then use the 1mm melamine pad to tighten the PTFE board
• After drilling, blow out the dust in the hole with a air gun
• With the most stable drill rig, drilling parameters (basically, the smaller the hole, the faster the drilling speed, the smaller the Chip load, the smaller the return speed)

Plasma treatment or sodium naphthalene activation treatment is conducive to pore metallialization

4. The PTH sinks the copper
After micro erosion (20 microinch control), pull from the oil removal cylinder at PTH

5. Welding

• Pre-treatment: use acid washing board, can not mechanical grinding board
• Pre-treatment after baking plate (90℃, 30min), brush green oil curing
• Divided into three sections: a section of 80℃, 100℃, 150℃, 30min each (if the substrate surface oil is found, it can be  reworked: wash off the green oil and reactivate it)

Spread the white paper on the line surface of PTFE board and clamp it with FR-4 substrate board with copper with a thickness of 1.0MM.