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Product information

2L ENIG Board

Layers: 2L Material: Fr-4 Board Thickness: 1.0mm Copper Thickness: 1.0OZ Min line width/ space: 0.1/0.15mm Surface finish: Immersion gold Certificate: UL, ISO, TS16949 Application: Consumer Electronics

Product specifications

Item Speci.
Layers 1-28
Board thickness 0.1mm-7.0mm
Material FR-4,CEM-1,PI,High Tg,Rogers
Max panel size 32"×32"(800mm×800mm)
Min hole size 0.1mm
Min line width 3mil(0.075mm)
Min line space 3mil(0.075mm)
Surface finish OSP,HASL,Imm Gold/Nickel/Ag, Electric gold
Copper thickness 0.5-7.0OZ
Soldermask Green/Yellow/Black/White/Red/Blue 
Min PAD 5mil(0.13mm)
Inter package Vacuum
Outer package Carton
Outline tolerance ±10%
Hole tolerance PTH:±0.076 NPTH:±0.05
Certificate UL,ISO 9001,ISO14001,TS16949
Special request Blind hole+Impedance control+ BGA
Analysis Layout,Routing,V-CUT,Gold finger  



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